Effects of stoichiometric mixing ratio on epoxy cure?a dielectric analysis
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry
Reference4 articles.
1. In-situMeasurement of the Properties of Curing Systems with Microdielectrometry
2. and Proc. 29th SAMPE Symposium, p. 1243, Reno, Nevada, April 1984.
3. Kinetics of cure of epoxy resin system bisphenol-A diglycidylether-di(4-aminophenyl)sulphone
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