Promotion of the mechanical properties and thermal conductivity of epoxy by low Si 3 N 4 whisker content and its mechanisms-Reference-Cited by-同舟云学术

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Promotion of the mechanical properties and thermal conductivity of epoxy by low Si 3 N 4 whisker content and its mechanisms

Published:2019-11-21 Issue:21 Volume:137 Page:48721
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Liu Xuan¹,Zhang Dian¹²,Liu Yijun³,Liu Jing¹,Yang Xiaofeng¹,Gao Yunqin¹,Ma Aiqiong¹

Affiliation:

1. College of Materials Science and Engineering, Xi'an University of Architecture and Technology Xi'an Shaanxi 710055 China

2. State Key Laboratory of Advance Refractories, Sinosteel Luoyang Institute of Refractories Research Co., Ltd. Luoyang Henan 471039 China

3. Monalisa Group Co. Ltd. Foshan Guangdong 528211 China

Funder

Key Research and Development Program of Shanxi Province

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.48721

Reference51 articles.

1. Failure mechanisms in toughened epoxy resins—A review

2. Deformation and fracture behaviour of a rubber-toughened epoxy: 1. Microstructure and fracture studies

3. Modelling of the toughening mechanisms in rubber-modified epoxy polymers

4. Thermoplastic-toughened epoxy polymers

5. Fracture toughness of epoxy polymer modified with nanosilica particles: Particle size effect

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1. Facile preparation of heat-conducting ceramics/epoxy composites by pre-constructing Si3N4–SiC skeleton from photovoltaic silicon waste;Ceramics International;2024-09

2. Preparation of high thermal conductivity vat photopolymerization used UV-curable resin synergistically enhanced by silicon nitride and boron nitride;Ceramics International;2024-07

3. Alveoli‐Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High‐Performance Thermal Interface Materials;Small;2023-12-03

4. One-flow multi-step synthesis of a monomer as a precursor of thermal-conductive semiconductor packaging polymer via multi-phasic separation;Journal of Industrial and Engineering Chemistry;2023-07

5. Thermal and dielectric multiple percolation in α‐Si₃N₄ whiskers/silicone rubber;Polymer Engineering & Science;2023-03-22

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