Solid State Foaming of Nickel, Monel, and Copper by the Reduction and Expansion of NiO and CuO Dispersions
Author:
Affiliation:
1. Department of Applied Engineering, Safety & Technology; Millersville University; Millersville PA USA
2. US Army Research Laboratory; Aberdeen Proving Ground MD USA
Funder
National Science Foundation CAREER Award
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/adem.201800302/fullpdf
Reference55 articles.
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5. NiSe Nanowire Film Supported on Nickel Foam: An Efficient and Stable 3D Bifunctional Electrode for Full Water Splitting
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