Ultra-Fast One-Step Fabrication of Cu2Se Thermoelectric Legs With Ni-Al Electrodes by Plasma-Activated Reactive Sintering Technique
Author:
Affiliation:
1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing; Wuhan University of Technology; Wuhan 430070 China
2. Department of Physics; University of Michigan; Ann Arbor Michigan 48109 USA
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Reference32 articles.
1. A novel high-performance photovoltaic–thermoelectric hybrid device
2. Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems
3. Performance analysis of a waste heat recovery thermoelectric generation system for automotive application
4. High thermoelectric figure of merit and improved mechanical properties in melt quenched PbTe–Ge and PbTe–Ge1−xSix eutectic and hypereutectic composites
5. Phase diagram of In–Co–Sb system and thermoelectric properties of In-containing skutterudites
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