Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites-Reference-Cited by-同舟云学术

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Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites

Published:2015-01-02 Issue:7 Volume:17 Page:1076-1084
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Chen Zhizhong¹,Tan Zhanqiu¹,Ji Gang²,Fan Genlian¹,Schryvers Dominique³,Ouyang Qiubao¹,Li Zhiqiang¹

Affiliation:

1. State Key Laboratory of Metal Matrix Composites; Shanghai Jiao Tong University; Shanghai 200240 China

2. Unité Matériaux et Transformations (UMET) CNRS UMR 8207; Université Lille1; 59655 Villeneuve d'Ascq France

3. Electron Microscopy for Materials Science (EMAT); University of Antwerp; Groenenborgerlaan 171 2020-Antwerp Belgium

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Reference25 articles.

1. Processing of Al/SiC composites in continuous solid–liquid co-existent state by SPS and their thermal properties

2. Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores: Numerical study and experimental validation

3. Thermal properties of diamond/SiC/Al composites with high volume fractions

4. Microstructure and microchemistry of the Al/SiC interface

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4. Research progress in high-performance aluminum matrix composites br;CAILIAO GONGCHENG;2023

5. Effect of thermal shock induced dislocation multiplication on the thermal conductivity of 60 vol% SiCp/Al–7Si composites;Composites Communications;2023-04

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