Bi‐Facial Substrates Enabled Heterogeneous Multi‐Dimensional Integrated Circuits (MD‐IC) for Internet of Things (IoT) Applications-Reference-Cited by-同舟云学术

Bi‐Facial Substrates Enabled Heterogeneous Multi‐Dimensional Integrated Circuits (MD‐IC) for Internet of Things (IoT) Applications

Published:2019-04-10 Issue:7 Volume:21 Page:1900043
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

El‐Atab Nazek¹,Shaikh Sohail F.¹,Khan Sherjeel M.¹,Hussain Muhammad M.¹²^ORCID

Affiliation:

1. mmh LabsElectrical EngineeringComputer Electrical Mathematical Science and Engineering DivisionKing Abdullah University of Science and Technology (KAUST)Thuwal 23955‐6900Saudi Arabia

2. EECSUniversity of CaliforniaBerkeleyCA 94720USA

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adem.201900043

Reference33 articles.

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3. A. T. Y.Lin J.Lee D.Lee C.‐C.Chen in2016 11th International Microsystems Packaging Assembly and Circuits Technology Conf. (IMPACT) 2016 pp.209–211

4. S.Pendharkar in2016 IEEE Symposium on VLSI Technology 2016 pp. 1‐2

5. G.Carchon X.Sun G.Posada D.Linten E.Beyne in2005 IEEE International Solid‐State Circuits Conference 2005. Digest of Technical Papers. ISSCC 2005 pp.398–399.

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