Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing
Author:
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Reference24 articles.
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2. Strength and sharp contact fracture of silicon
3. P. A. Wang Proc. 4th WCPEC, Waikoloa, HI, USA 2006 1179
4. Wafering of silicon crystals
5. Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
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