Thermal and Electrical Conductivity of 99.9% Pure Copper Processed via Selective Electron Beam Melting
Author:
Affiliation:
1. Zentralinstitut für Neue Materialien und Prozesstechnik (ZMP); 90762 Fürth Germany
2. Friedrich-Alexander-Universität Erlangen-Nürnberg; Lehrstuhl für Werkstoffkunde und Technologie der Metalle (WTM); 91058 Erlangen Germany
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/adem.201600078/fullpdf
Reference31 articles.
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3. Interfacial characterization of SLM parts in multi-material processing: Metallurgical diffusion between 316L stainless steel and C18400 copper alloy
4. P. Frigola R. Agustsson S. Boucher A. Murokh J. Rosenzweig G. Travish L. Faillace D. Cormier T. Mahale Proceedings of EPAC08 2008
5. Open-cellular copper structures fabricated by additive manufacturing using electron beam melting
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