Preparation and curing behavior of latent 2‐PhIm‐PS microcapsule curing agent for epoxy resin-Reference-Cited by-同舟云学术

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Preparation and curing behavior of latent 2‐PhIm‐PS microcapsule curing agent for epoxy resin

Published:2020-12-25 Issue:19 Volume:138 Page:50379
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Yan Yi¹,Guo Xu²³,Li Jinhuan¹^ORCID,Zhang Jiaojiao¹,Li Andong¹,Ren Linlin¹,Yu Hongyan⁴

Affiliation:

1. College of Material Science and Technology Nanjing University of Aeronautics and Astronautics Nanjing China

2. Research Development Center Changzhou Hexin Daxu New Energy Technology Development Co., Ltd Changzhou China

3. Research Development Center Jiangsu CTC Technical Fabrics Co., Ltd Changzhou China

4. Beijing Key Laboratory of Radiation Advanced Materials Beijing Research Center for Radiation Application Beijing China

Funder

Chinese Aeronautical Establishment

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.50379

Reference32 articles.

1. Thermal, mechanical properties and shape memory performance of a novel phthalide-containing epoxy resins

2. The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

3. Kinetics and properties of diethyltoluenediamine type benzoxazine-cured diglycidyl ether of bisphenol-A

4. Synthesis and Modifications of Epoxy Resins and Their Composites: A Review

5. Synthesis of a novel flame retardant based on cyclotriphosphazene and DOPO groups and its application in epoxy resins

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1. Preparation of low‐temperature curing single‐component epoxy adhesives with sedimentation coated accelerators;Journal of Applied Polymer Science;2024-08-17

2. Preparation and Application of Latent Microcapsule Catalysts in One-Component Silicone Rubber Curing;Industrial & Engineering Chemistry Research;2024-05-17

3. One-component epoxy resin adhesive featured with high storage stability based on microencapsulation;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-02

4. Design and synthesis of polyetherimides as a flame-retarded thermolatent hardener for high-performance epoxy thermosets;Composites Part B: Engineering;2023-06

5. Preparation and curing behaviour of microencapsulated curing agents for cold-mixed epoxy asphalt;Journal of Microencapsulation;2023-05-25

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