Formation of triazole inhibitive film on copper surface by click assembly in presence of Cu 2 S quantum dots-Reference-Cited by-同舟云学术

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Formation of triazole inhibitive film on copper surface by click assembly in presence of Cu 2 S quantum dots

Published:2021-06-28 Issue:9 Volume:53 Page:779-791
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf Interface Anal

Author:

Gao Lixin¹,Wu Panpan¹²,Zhang Kai¹²,Li Jin¹,Zhang Daquan¹²^ORCID

Affiliation:

1. Shanghai Key Laboratory of Materials Protection and Advanced Materials in Electric Power Shanghai University of Electric Power Shanghai China

2. Shanghai Engineering Research Centre of Energy‐Saving in Heat Exchange Systems Shanghai 200090 P. R. China

Funder

Science and Technology Commission of Shanghai Municipality

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sia.6979

Reference61 articles.

1. Corrosion inhibition of copper, mild steel and galvanically coupled copper-mild steel in artificial sea water in presence of 1H-benzotriazole, sodium molybdate and sodium phosphate

2. Controlled deposition of size-selected metal nanoclusters on prepatterned substrate

3. New insights into adsorption bonding of imidazole: A viable C2–H bond cleavage on copper surfaces

4. The inhibition mechanism of a new synthesized indole derivative for copper in acidic environment via experimental and theoretical study

5. In situ growth and protectiveness mechanism of layered double hydroxide/oxide hierarchical structure on copper alloy in 3.5 wt% NaCl solution

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Controlled Synthesis of Triazole Polymers Via Atrp/Click Chemistry Reaction and Preparation of Their Self-Assembled Film Against Copper Corrosion;2024

2. Novel method for protecting copper: An in-situ click-assembly film on copper surface;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-11

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