Microscopic deformation and failure modes of high‐functionality epoxy resins from bond breaking molecular dynamics simulations and experimental investigation-Reference-Cited by-同舟云学术

Microscopic deformation and failure modes of high‐functionality epoxy resins from bond breaking molecular dynamics simulations and experimental investigation

Published:2022-09-26 Issue:12 Volume:62 Page:3952-3963
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polymer Engineering & Sci

Author:

Jang Chang Woon¹^ORCID,Mullinax J. Wayne¹,Kang Jin Ho²,Palmieri Frank L.³,Hudson Tyler B.³,Lawson John W.⁴

Affiliation:

1. KBR, Inc., Intelligent Systems Division, NASA Ames Research Center Moffett Field California USA

2. National Institute of Aerospace Hampton Virginia USA

3. NASA Langley Research Center Hampton Virginia USA

4. Intelligent Systems Division, NASA Ames Research Center, Moffett Field Santa Clara California USA

Funder

Aeronautics Research Mission Directorate

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pen.26157

Reference46 articles.

1. Molecular dynamics simulation of crosslinked epoxy resins: Curing and mechanical properties

2. Study of temperature dependence of thermal conductivity in cross-linked epoxies using molecular dynamics simulations with long range interactions

3. Interfacial shear strength of cured vinyl ester resin-graphite nanoplatelet from molecular dynamics simulations

4. Molecular dynamics simulation of cross-linked urea-formaldehyde polymers for self-healing nanocomposites: prediction of mechanical properties and glass transition temperature

5. Glass Transition Temperatures of Polymers from Molecular Dynamics Simulations

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