Modeling technique of the conducted emission of integrated circuit under different temperatures

Author:

Berbel Nestor1,Fernández-García Raúl1,Gil Ignacio1

Affiliation:

1. Electronic Engineering; Universitat Politècnica de Catalunya; Spain

Funder

Ministerio de Economía y Competitividad

Agència de Gestió d’Ajuts Universitaris i de Recerca

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation

Reference16 articles.

1. The electromagnetic compatibility of integrated circuits-past, present, and future;Ramdani;IEEE Trans Electromagn Compat,2009

2. IEC Standard Models of integrated circuits for EMI behavioral simulation - conducted emission modelling (ICEM-CE) IEC 62433-2 2006

3. Modeling the electromagnetic emission of a microcontroller using a single model;Labussiere-Dorgan;IEEE Trans Electromagn Compat,2008

4. JL Levant C Marot M Meyer M Ramdani Solving ASIC decoupling with the ICEM-CE model 2009

5. EMC assessment at chip and PCB level: use of the ICEM model for jitter analysis in an integrated PLL;Jean-Luc;IEEE Trans Electromagn Compat,2007

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Conducted Emissions Modeling Method for Radio Frequency Integrated Circuits;2024 IEEE INC-USNC-URSI Radio Science Meeting (Joint with AP-S Symposium);2024-07-14

2. Temperature effects on the conducted emission of a high-side switch;Microelectronics Reliability;2021-11

3. An ICIM-CI-T Model for EMI Prediction of IO Element on Typical FPGA With Temperature Effect Considered;IEEE Transactions on Electromagnetic Compatibility;2020-06

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