Influence of model parameter estimation methods and regression algorithms on curing kinetics and rheological modelling
Author:
Affiliation:
1. Institute of Polymer Materials and Plastics Engineering; TU Clausthal; Agricolastr. 6 Clausthal-Zellerfeld 38678 Germany
2. Clausthal Center for Materials Technology, TU Clausthal; Leibnizstraße 9 Clausthal-Zellerfeld 38678 Germany
Funder
German Research Foundation
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference32 articles.
1. A cure kinetics, diffusion controlled and temperature dependent, identification of the Araldite LY556 epoxy
2. Cure kinetics and viscosity modelling of a high-performance epoxy resin film
3. Cure kinetics characterization and monitoring of an epoxy resin using DSC, Raman spectroscopy, and DEA
4. Curing kinetics and chemorheology of epoxy/anhydride system
Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Evaluating Models That Predict Epoxy Conversion Using Rheological Properties;ACS Applied Polymer Materials;2024-04-15
2. Generating Spatiotemporal Seamless Data of Clear-Sky Land Surface Temperature Using Synthetic Aperture Radar, Digital Elevation Mode, and Machine Learning over Vegetation Areas;Journal of Remote Sensing;2024-01
3. Curing and thermal degradation behavior of epoxy‐based vitrimers;Journal of Applied Polymer Science;2023-12-15
4. Nanofiller Effects on the Isothermal Curing Kinetics of Epoxy Resin;Theoretical Foundations of Chemical Engineering;2023-12
5. Characterization and mechanisms of the phase's formation evolution in sol-gel derived mullite/cordierite composite;Ceramics International;2023-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3