Thin Copper Flakes for Conductive Inks Prepared by Decomposition of Copper Formate and Ultrafine Wet Milling-Reference-Cited by-同舟云学术

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Thin Copper Flakes for Conductive Inks Prepared by Decomposition of Copper Formate and Ultrafine Wet Milling

Published:2018-10-25 Issue:1 Volume:4 Page:1800426
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Rosen Yitzchak¹^ORCID,Marrach Roy¹,Gutkin Vitaly²,Magdassi Shlomo¹^ORCID

Affiliation:

1. Casali Center for Applied Chemistry; Institute of Chemistry; The Hebrew University of Jerusalem; Jerusalem 91904 Israel

2. The Harvey M. Krueger Family Center for Nanoscience and Nanotechnology; The Hebrew University of Jerusalem; Jerusalem 91904 Israel

Funder

Ministry of Science, Technology and Space

National Research Foundation Singapore

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/admt.201800426/fullpdf

Reference55 articles.

1. Conductive Nanomaterials for Printed Electronics

2. Biocompatible Batteries—Materials and Chemistry, Fabrication, Applications, and Future Prospects

3. Towards flexible solid-state supercapacitors for smart and wearable electronics

4. Printable Transparent Conductive Films for Flexible Electronics

5. Soft, Wet and Ionic Microelectrode Systems

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1. Preparation of graphene-coated Cu particles with oxidation resistance by flash joule heating;Carbon;2024-04

2. Stability and conductivity of water-based colloidal silver nanoparticles conductive inks for sustainable printed electronics;Journal of the Taiwan Institute of Chemical Engineers;2023-12

3. Amphibious epidermal area networks for uninterrupted wireless data and power transfer;Nature Communications;2023-11-18

4. Producing Metal Powder from Machining Chips Using Ball Milling Process: A Review;Materials;2023-06-27

5. Mechanochemically Assisted Synthesis of Cu–Ag Microflakes;Powders;2023-06-01

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