A New Printed Electronics Approach Eliminating Redundant Fabrication Process of Vertical Interconnect Accesses: Building Multilayered Circuits in Porous Materials-Reference-Cited by-同舟云学术

A New Printed Electronics Approach Eliminating Redundant Fabrication Process of Vertical Interconnect Accesses: Building Multilayered Circuits in Porous Materials

Published:2018-02-08 Issue:4 Volume:3 Page:1700346
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Zhang Tengyuan¹,Asher Eaton²,Yang Jun¹

Affiliation:

1. Department of Mechanical and Materials Engineering; Faculty of Engineering; Western University; London Ontario N6A 3K7 Canada

2. Department of Interdisciplinary Sciences; Schulich School of Medicine & Dentistry; Western University; London Ontario N6A 3K7 Canada

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Reference45 articles.

1. A Stretchable Form of Single-Crystal Silicon for High-Performance Electronics on Rubber Substrates

2. Organic materials for printed electronics

3. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

4. A review of fabrication and applications of carbon nanotube film-based flexible electronics

5. Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology

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