Fabrication with Semiconductor Packaging Technologies and Characterization of a Large‐Scale Flexible Thermoelectric Module-Reference-Cited by-同舟云学术

Fabrication with Semiconductor Packaging Technologies and Characterization of a Large‐Scale Flexible Thermoelectric Module

Published:2018-12-14 Issue: Volume: Page:1800556
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Sugahara Tohru¹,Ekubaru Yusufu¹,Nong Ngo Van²,Kagami Noriko¹,Ohata Keiichi³,Hung Le Thanh²,Okajima Michio³,Nambu Shutaro³,Suganuma Katsuaki¹

Affiliation:

1. Department of Advanced Interconnection MaterialsThe Institute of Scientific and Industrial ResearchOsaka University Mihogaoka 8‐1 Ibaraki Osaka 567‐0047 Japan

2. Department of Energy Conversion and StorageTechnical University of Denmark Frederiksborgvej 399 Roskilde 4000 Denmark

3. E‐ThermoGentek Co., Ltd. 102 Kujyo CID bld. 13 Shimotonodacho, Higashikujo, Minami‐ku Kyoto 601‐8047 Japan

Funder

Japan Society for the Promotion of Science

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.201800556

Reference30 articles.

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2. Review of Micro Thermoelectric Generator

3. Energy Scavenging for Mobile and Wireless Electronics

4. Complex thermoelectric materials

5. High-performance bulk thermoelectrics with all-scale hierarchical architectures

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