Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices-Reference-Cited by-同舟云学术

Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices

Published:2018-08-08 Issue:11 Volume:3 Page:1800159
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Jung Han Hee¹,Song Juwon¹,Nie Shuang²,Jung Han Na¹,Kim Min Seok³,Jeong Jae-Woong⁴,Song Young Min³,Song Jizhou²,Jang Kyung-In¹^ORCID

Affiliation:

1. Department of Robotics Engineering; Department of Information and Communication Engineering; Brain Engineering Convergence Center; Daegu Gyeongbuk Institute of Science and Technology; Daegu 49288 Republic of Korea

2. Department of Engineering Mechanics; Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province; Zhejiang University; Hangzhou 310027 China

3. School of Electrical Engineering and Computer Science; Gwangju Institute of Science and Technology; 123 Cheomdan-gwagiro Buk-gu Gwangju 61005 Republic of Korea

4. School of Electrical Engineering; Korea Advanced Institute of Science and Technology; Daejeon 34141 Republic of Korea

Funder

National Research Foundation of Korea

Ministry and ICT

National Natural Science Foundation of China

National Basic Research Program

Fundamental Research Funds for the Central Universities

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link