Truly Low Temperature Sintering of Printed Copper Ink Using Formic Acid-Reference-Cited by-同舟云学术

Truly Low Temperature Sintering of Printed Copper Ink Using Formic Acid

Published:2018-09-25 Issue:12 Volume:3 Page:1800146
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Hermerschmidt Felix¹,Burmeister David¹,Ligorio Giovanni¹,Pozov Sergey M.²,Ward Richard³,Choulis Stelios A.²,List‐Kratochvil Emil J. W.¹

Affiliation:

1. Institut für PhysikInstitut für ChemieIRIS AdlershofHumboldt‐Universität zu Berlin Brook‐Taylor‐Straße 6 12489 Berlin Germany

2. Department of Mechanical Engineering and Materials Science and EngineeringCyprus University of Technology 45 Kitiou Kyprianou Street 3041 Limassol Cyprus

3. Intrinsiq Materials Ltd.Cody Technology Park Ively Road Farnborough Hampshire GU14 0LX UK

Funder

FP7 Nanosciences, Nanotechnologies, Materials and new Production Technologies

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.201800146

Reference40 articles.

1. High-Resolution Inkjet Printing of All-Polymer Transistor Circuits

2. Direct Ink-Jet Printing of Ag-Cu Nanoparticle and Ag-Precursor Based Electrodes for OFET Applications

3. High performance indium tin oxide-free solution-processed organic light emitting diodes based on inkjet-printed fine silver grid lines

4. Highly efficient indium tin oxide-free organic photovoltaics using inkjet-printed silver nanoparticle current collecting grids

5. Printed Copper Nanoparticle Metal Grids for Cost-Effective ITO-Free Solution Processed Solar Cells

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