Thermoplastic polydimethylsiloxane with l ‐phenylalanine‐based hydrogen‐bond networks
Author:
Affiliation:
1. Department of Mechanical EngineeringKeio University3‐14‐1 Hiyoshi, Kohoku‐ku Yokohama223‐8522 Japan
2. Department of Applied ChemistryWaseda University3‐4‐1 Okubo, Shinjuku‐ku Tokyo169‐8555 Japan
Funder
Japan Society for the Promotion of Science
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.45419
Reference22 articles.
1. Flexible conductive films fabricated by evaporation on partially cured polydimethyl-siloxane
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5. PEG-based nanocomposite hydrogel: Thermoresponsive sol-gel transition controlled by PLGA-PEG-PLGA molecular weight and solute concentration
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