Affiliation:
1. College of Materials Science and Chemical Engineering Harbin Engineering University Harbin 150001 P. R. China
2. Yantai Research Institute and Graduate School of Harbin Engineering University Yantai 265000 P. R. China
3. Heilongjiang Ecological Environment Monitoring Center Harbin 150001 P. R. China
Abstract
AbstractCurrently, heat accumulation has seriously affected the stabilities and life of electronic devices. Polyimide (PI) film with high thermal conductivity coefficient (λ) has long been held up as an ideal solution for heat dissipation. Based on the thermal conduction mechanisms and classical thermal conduction models, this review presents design ideas of PI films with microscopically ordered liquid crystalline structures which are of great significance for breaking the limit ofλenhancement and describes the construction principles of thermal conduction network in high‐λfiller strengthened PI films. Furthermore, the effects of filler type, thermal conduction paths, and interfacial thermal resistances on thermally conductive behavior of PI film are systematically reviewed. Meanwhile, this paper summarizes the reported research and provides an outlook on the future development of thermally conductive PI films. Finally, it is expected that this review will give some guidance to future studies in thermally conductive PI film.
Funder
Fundamental Research Funds for the Central Universities
National Natural Science Foundation of China
Heilongjiang Provincial Postdoctoral Science Foundation
Subject
Materials Chemistry,Polymers and Plastics,Organic Chemistry
Cited by
2 articles.
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