The Chemistry of Wet Surface Preparation-Reference-Cited by-同舟云学术

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The Chemistry of Wet Surface Preparation

Published:2013-03-14 Issue: Volume: Page:187-232
ISSN:
Container-title:Chemistry in Microelectronics
language:
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Author:

Le Tiec Yannick,Knotter Martin

Publisher

John Wiley & Sons, Inc.

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9781118578070.ch3/fullpdf

Reference69 articles.

1. The solubility of amorphous silica in water;Alexander;Journal of Physical Chemistry,1954

2. A high-temperature batch spray process for implanted resist stripping;Butterbaugh;Solid State Technology,2006

3. All wet stripping of implanted photoresist;Christenson;Solid State Phenomena,2008

4. An integrated wet chemical etchstrip-clean sequence;Coze;Solid State Technology,2000

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Elimination of Si-C Defect on Wafer Surface in High-Temperature SPM Process Through Nitrogen Purge in 300-mm Single-Wafer Chamber;IEEE Transactions on Semiconductor Manufacturing;2024-08

2. Photovoltaic recycling: enhancing silicon wafer recovery process from damaged solar panels;Journal of Materials Science: Materials in Electronics;2024-04

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