Design and Fabrication of Metallic-Conductive Polymer-Based Hybrid Film Interconnections for Stretchable Electronic Devices

Author:

Sucharitha M.1ORCID,Thomas Reena2,Jyothi B.3,Onyema Edeh Michael4ORCID,Bekele Gashaw5ORCID

Affiliation:

1. School of Electronics Engineering, VIT-AP University, Amaravati, Andhra Pradesh, India

2. Noorul Islam Centre for Higher Education, Kumarcoil, Thuckalay, India

3. Electronics and Communication Engineering, Malla Reddy College of Engineering and Technology, Hyderabad, India

4. Department of Vocational and Technical Education, Faculty of Education, Alex Ekwueme Federal University, Ndufu-Alike, Abakaliki, Nigeria and Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences, Chennai, India

5. Department of Information System, WOLLO University, Kombolcha Institute of Technology, Kombolcha Post Box No. 208, Ethiopia

Abstract

Stretchable circuit is a technological innovation that has transformed the microelectronic landscape due to its enormous applications in the field of medicine. The consistency or durability of health monitoring devices can increase the dependability with which non-invasive clinical measures are collected. Metal–conductive polymer (CP) hybrid interconnects and metal–polyimide dual-layered interconnects were all produced as stretchable interconnections. Stretchable substrate for all of the interconnects was selected as soft elastomer polydimethylsiloxane (PDMS). However, the PDMS substrate presents challenges because it is temperature sensitive, limiting the process temperature. The extreme hydrophobic nature of the PDMS surface makes it difficult to deposit components that contain water and results in poor adhesion with different metals. Following the development of processes for fabricating materials on the PDMS substrate, methods for resolving these issues were investigated.

Publisher

Hindawi Limited

Subject

Polymers and Plastics

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