Thermal Characteristic Investigation for a Multichip Module Based on APDL

Abstract

Aiming at the failure problems of integrated circuit (IC) caused by higher package density, thinner package, and more heat sources, taking a multichip module (MCM) for receiver front end as an example, the 3-D model is established based on ANSYS Parametric Design Language (APDL). Then, the steady-state thermal analysis is achieved to complete the automatic calculation of thermal characteristic. As a result, the temperature, stress, and deformation are investigated in details, and its temperature distribution, stress distribution, deformation distribution, and reliability variations of this MCM under different powers and temperatures can be obtained. This can provide important theoretical reference for the chip package optimization. Different from other studies which only focus on temperature or stress, it is more comprehensive and systematic for the thermal characteristic analysis of MCM. Meanwhile, this MCM is also representative for wireless communication system. It is of great significance to optimize the layout design and improve the thermal characteristic for IC.