Review of 3D Printed Millimeter-Wave and Terahertz Passive Devices

Author:

Zhang Bing1,Chen Wei2,Wu Yanjie3ORCID,Ding Kang4,Li Rongqiang5ORCID

Affiliation:

1. College of Electronics and Information Engineering, Sichuan University, Chengdu 610064, China

2. Department of Electrical and Computer Engineering, Faculty of Engineering, National University of Singapore, Singapore 117583

3. School of Physics and Optoelectronic Engineering, Guangdong University of Technology, Guangzhou 510006, China

4. National Key Laboratory on Electromagnetic Environmental Effects and Electro-Optical Engineering, PLA University of Science and Technology, Nanjing 210007, China

5. School of Electronic Engineering, Chengdu University of Information Technology, Chengdu 610225, China

Abstract

The 3D printing technology is catching attention nowadays. It has certain advantages over the traditional fabrication processes. We give a chronical review of the 3D printing technology from the time it was invented. This technology has also been used to fabricate millimeter-wave (mmWave) and terahertz (THz) passive devices. Though promising results have been demonstrated, the challenge lies in the fabrication tolerance improvement such as dimensional tolerance and surface roughness. We propose the design methodology of high order device to circumvent the dimensional tolerance and suggest specific modelling of the surface roughness of 3D printed devices. It is believed that, with the improvement of the 3D printing technology and related subjects in material science and mechanical engineering, the 3D printing technology will become mainstream for mmWave and THz passive device fabrication.

Funder

Sichuan University

Publisher

Hindawi Limited

Subject

Electrical and Electronic Engineering

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