Research and Development of Digital Assembly Process System for Ultrasonic Transducers

Author:

Feng Xinyu1ORCID,Zhu Xijing1ORCID,Zhao Wei1ORCID,Shi Ruimin1ORCID

Affiliation:

1. School of Mechanical Engineering, North University of China, Taiyuan, Shanxi 030051, China

Abstract

In order to solve the problem of design efficiency of the digital assembly process, the author proposes a research using ultrasonic transducer technology. The main content of this research is to study the ultrasonic transducer elements according to the basic structure of the ultrasonic transducer.Through the study of equivalent circuit of ultrasonic transducer, the model of impedance matching design is constructed. Finally, the feasibility of ultrasonic transducer technology is obtained through experiments. Experimental results show that the transducer multichip structure of the ultrasonic transducer system and the LC matching network circuit can make the AOTF system achieve better results, and the diffraction efficiency is up to more than 70%, which is of great significance to the research and development of the current digital assembly process system. Conclusion. It is proven that the research of ultrasonic transducer technology can meet the needs of digital assembly process design efficiency.

Funder

North University of China

Publisher

Hindawi Limited

Subject

Computer Networks and Communications,Information Systems

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3