Affiliation:
1. School of Electronic Engineering, South Australian Institute of Technology, Adelaide, Australia
Abstract
Through making use of the analogy between electrical current and thermal heat flow, thermal calculations for thick film substrates may be undertaken using standard computer aided design programs such as SPICE 2. Chip temperature and substrate isotherms for various conditions can readily be determined. Parameters considered in this paper are chip position on substrate, with and without heat sink, number of chips on a substrate and substrate materials.
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Thick film standard paste temperature sensor applications;Sensors and Actuators;1985-09
2. Literaturverzeichnis;Informationstechnik und Datenverarbeitung;1985