A SiGe BiCMOS Instrumentation Channel for Extreme Environment Applications-Reference-Cited by-同舟云学术

A SiGe BiCMOS Instrumentation Channel for Extreme Environment Applications

Published:2010-02-16 Issue: Volume:2010 Page:1-12
ISSN:1065-514X
Container-title:VLSI Design
language:en
Short-container-title:VLSI Design

Author:

Ulaganathan Chandradevi¹,Nambiar Neena¹,Cornett Kimberly²,Greenwell Robert L.¹,Yager Jeremy A.³,Prothro Benjamin S.¹,Tham Kevin¹,Chen Suheng¹,Broughton Richard S.²,Fu Guoyuan²,Blalock Benjamin J.¹,Britton Charles L.¹,Ericson M. Nance¹,Mantooth H. Alan²,Mojarradi Mohammad M.⁴,Berger Richard W.⁵,Cressler John D.⁶

Affiliation:

1. Department of Electrical Engineering and Computer Science, The University of Tennessee, Knoxville, TN 37996, USA

2. Department of Electrical Engineering, University of Arkansas, Fayetteville, AR 72701, USA

3. Power and Sensor Electronics, Jet Propulsion Laboratory, Pasadena, CA 91109, USA

4. Instrument Electronics and Sensors, Jet Propulsion Laboratory, Pasadena, CA 91109, USA

5. Space Products and Systems, BAE Systems, Manassas, VA 20110, USA

6. School of Electrical and Computer Engineering, Georgia Institute of Technology, tlanta, GA 30332, USA

Abstract

An instrumentation channel is designed, implemented, and tested in a 0.5-μm SiGe BiCMOS process. The circuit features a reconfigurable Wheatstone bridge network that interfaces an assortment of external sensors to signal processing circuits. Also, analog sampling is implemented in the channel using a flying capacitor configuration. The analog samples are digitized by a low-power multichannel A/D converter. Measurement results show that the instrumentation channel supports input signals up to 200 Hz and operates across a wide temperature range of -180°C to 125°C. This work demonstrates the use of a commercially available first generation SiGe BiCMOS process in designing circuits suitable for extreme environment applications.

Funder

NASA ETDP Program

Publisher

Hindawi Limited

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Hardware and Architecture

Link

http://downloads.hindawi.com/archive/2010/156829.pdf

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