Simulation Research on Thermal Characteristics and Experimental Study on Electronic Control Board of the Miniature High-Speed Digital Valve

Author:

Yang Meisheng123ORCID

Affiliation:

1. School of Mechanical Engineering, Anhui University of Technology, Maanshan, Anhui 243002, China

2. The State Key Laboratory of Mechanical Transmissions, Chongqing University, Chongqing 400044, China

3. Engineering Technology Research Center of Hydraulic Vibration Technology, Anhui Province, Anhui University of Technology, Maanshan, Anhui 243002, China

Abstract

The miniature high-speed digital valve is essentially a kind of miniature system that contains many nonlinear factors and involves multifield coupling among electromagnetic, mechanical, and liquid ones. In this study, the dimension of an electromagnetic structure is normalized into a unified variable, and the numerical analysis method is used to optimize the values of each parameter size on the premise of satisfying the requirements. The electronic control board is the control signal input equipment of the valve. The input changes of voltage and current directly affect the thermal characteristics of the valve. The electronic control board is the power source of the digital valves, and their high speed partially depends on the characteristics of the electronic control board. In this study, a control board for miniature digital valves was developed, which realizes the rapid rise and fall of current and meets the design requirements. A new electronic control board is manufactured, and a control platform for the electronic control board is built. Experiments demonstrate that there is no delay in the current rise and fall, showing that the valve achieves its dynamic response target. Using the finite element analysis software Workbench to simulate it numerically, the temperature field distribution in the original structure is not uniform, which affects the magnetic properties of the electromagnetic field. To address this disadvantage, this study proposes to insulate the heat source with thermal insulation material, which will not affect the temperature distribution of the entire electromagnetic components. The simulations show that the proposed method is effective and reliable.

Funder

National Natural Science Foundation of China

Publisher

Hindawi Limited

Subject

General Engineering,General Materials Science

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