The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching-Reference-Cited by-同舟云学术

The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching

Published:2016 Issue: Volume:2016 Page:1-7
ISSN:0882-7516
Container-title:Active and Passive Electronic Components
language:en
Short-container-title:Active and Passive Electronic Components

Author:

Shang Y.¹,Xu H.¹,Mo J.¹^ORCID,Wang Z.¹,Xu X.¹,Tu Z.¹,Zhang X.²,Zheng H.¹,Chen W.¹,Yu F.¹

Affiliation:

1. School of Aeronautics and Astronautics, Zhejiang University, No. 38 Zheda Road, Hangzhou 310027, China

2. Hangzhou College of Commerce, Zhejiang Gongshang University, No. 18, Xuezheng Street, Hangzhou 310018, China

Abstract

A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope™infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.

Funder

Scientific Research Fund of Zhejiang Provincial Education Department

Publisher

Hindawi Limited

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://downloads.hindawi.com/journals/apec/2016/6295405.pdf

Reference12 articles.

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