Morphology of Near- and Semispherical Melted Chips after the Grinding Processes Using Sol-Gel Abrasives Based on SEM-Imaging and Analysis-Reference-Cited by-同舟云学术

Morphology of Near- and Semispherical Melted Chips after the Grinding Processes Using Sol-Gel Abrasives Based on SEM-Imaging and Analysis

Published:2016 Issue: Volume:2016 Page:1-12
ISSN:1687-8434
Container-title:Advances in Materials Science and Engineering
language:en
Short-container-title:Advances in Materials Science and Engineering

Author:

Kapłonek W.¹,Nadolny K.²^ORCID,Habrat W.³

Affiliation:

1. Subject Group of Metrology and Quality, Department of Mechanical Engineering, Faculty of Mechanical Engineering, Koszalin University of Technology, Racławicka 15-17, 75-620 Koszalin, Poland

2. Department of Mechanical Engineering, Faculty of Mechanical Engineering, Koszalin University of Technology, Racławicka 15-17, 75-620 Koszalin, Poland

3. Department of Manufacturing Techniques and Automation, Faculty of Mechanical Engineering and Aeronautics, Rzeszów University of Technology, Wincentego Pola 2, 35-959 Rzeszów, Poland

Abstract

Selected issues related to SEM-imaging and image analysis of spherical melted chips formed during the grinding process are presented and discussed. The general characteristics of this specific group of machining products are given. Chip formation phenomena, as well as their overall morphology, are presented using selected examples of near- and semispherical melted chips occurring singly or concentrated in clusters on the grinding wheel surface after the machining process. Observation of the spherical melted chips and acquisition of their images were carried out for grinding wheel active surfaces with microcrystalline sintered corundum abrasive grains SG™after the internal cylindrical grinding process of a 100Cr6 steel and Titanium Grade 2® alloy by use of a scanning electron microscope, JEOL JSM-5500LV. Analysis of the obtained SEM micrographs was carried out by Image-Pro® Plus 5.0 software to determine the selected geometrical parameters describing the morphological features of the assessed chips.

Publisher

Hindawi Limited

Subject

General Engineering,General Materials Science

Link

http://downloads.hindawi.com/journals/amse/2016/2573920.pdf

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