Formation of Porous Structure with Subspot Size under the Irradiation of Picosecond Laser Pulses

Author:

Liu Bin1,Wang Wenjun1,Jiang Gedong1,Mei Xuesong1,Wang Kedian1,Wang Jiuhong1

Affiliation:

1. State Key Laboratory for Manufacturing System Engineering, Xi'an Jiaotong University, Xi'an 710054, China

Abstract

A study was presented in this paper on porous structure with microsize holes significantly smaller than laser spot on the stainless steel 304 target surface induced by a picosecond Nd:van regenerative amplified laser, operating at 1064 nm. The target surface variations were studied in air ambience. The estimated surface damage threshold was 0.15 J/cm2. The target specific surface changes and phenomena observed supported a complementary study on the formation and growth of the subspot size pit holes on metal surface with dependence of laser pulse number of 50–1000 and fluences of 0.8 and 1.6 J/cm2. Two kinds of porous structures were presented: periodic holes are formed from Coulomb Explosion during locally spatial modulated ablation, and random holes are formed from the burst of bubbles in overheated liquid during phase explosion. It can be concluded that it is effective to fabricate a large metal surface area of porous structure by laser scanning regime. Generally, it is also difficult for ultrashort laser to fabricate the microporous structures compared with traditional methods. These porous structures potentially have a number of important applications in nanotechnology, industry, nuclear complex, and so forth.

Funder

National Natural Science Foundation of China

Publisher

Hindawi Limited

Subject

General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3