Room Temperature Imprint Using Crack-Free Monolithic SiO2-PVA Nanocomposite for Fabricating Microhole Array on Silica Glass

Author:

Fujino Shigeru1,Ikeda Hiroshi1

Affiliation:

1. Art, Science and Technology Center for Cooperative Research, Kyushu University, Kasuga-shi, Fukuoka 816-8580, Japan

Abstract

This paper aims to fabricate microhole arrays onto a silica glass via a room temperature imprint and subsequent sintering by using a monolithic SiO2-poly(vinyl alcohol) (PVA) nanocomposite as the silica glass precursor. The SiO2-PVA suspension was prepared from fumed silica particles and PVA, followed by drying to obtain tailored SiO2-PVA nanocomposites. The dependence of particle size of the fumed silica particles on pore size of the nanocomposite was examined. Nanocomposites prepared from 7 nm silica particles possessed suitable mesopores, whereas the corresponding nanocomposites prepared from 30 nm silica particles hardly possessed mesopores. The pore size of the nanocomposites increased as a function of decreasing pH of the SiO2-PVA suspension. As a consequence, the crack-free monolithic SiO2-PVA nanocomposite was obtained using 7 nm silica particles via the suspension at pH 3. Micropatterns were imprinted on the monolithic SiO2-PVA nanocomposite at room temperature. The imprinted nanocomposite was sintered to a transparent silica glass at 1200°C in air. The fabricated sintered glass possessed the microhole array on their surface with aspect ratios identical to the mold.

Funder

Japan Society for the Promotion of Science

Publisher

Hindawi Limited

Subject

General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3