Molecular dynamics simulation of Ti-6AL-4V diffusion bonding behavior under different process parameters-Reference-Cited by-同舟云学术

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Molecular dynamics simulation of Ti-6AL-4V diffusion bonding behavior under different process parameters

Published:2020-06-20 Issue:3 Volume:54 Page:365-372
ISSN:1580-2949
Container-title:Materiali in Tehnologije
language:
Short-container-title:Mater. Tehnol.

Author:

Liu X.,Xu L.,Zhang S.

Publisher

Institute of Metals and Technology

Subject

Metals and Alloys,Polymers and Plastics

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temperature effects on solid state bonding joints of ultrafine-grained CNT/Al–Cu–Mg composites;Composites Part B: Engineering;2024-09

2. Molecular dynamics simulation study of Zr interposer promoting Cu-Cu low-temperature hybrid bonding;Materials Today Communications;2024-08

3. Self-assembly and drug release mechanisms of mechano-responsive and antibacterial F127-Rif hydrogels;Macromolecular Research;2023-02

4. Multilayer composite Ti-6Al-4 V/Cp-Ti alloy produced by laser direct energy deposition;The International Journal of Advanced Manufacturing Technology;2022-11-25

5. Multilayer composite Ti-6Al-4V/Cp-Ti alloys produced by Laser Direct energy Deposition;2022-08-09

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