Influence of additives and pulse parameters on uniformity of through-hole copper plating-Reference-Cited by-同舟云学术

Influence of additives and pulse parameters on uniformity of through-hole copper plating

Published:2010-09 Issue:5 Volume:88 Page:272-276
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Wang Z.X.,Wang S.,Yang Z.,Wang Z.L.

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/002029610X12791981507884

Reference16 articles.

1. Frequency Effect of Pulse Plating on the Uniformity of Copper Deposition in Plated Through Holes

2. J. Jorne: 'Challenges in copper interconnect technology: macro-uniformity and micro-filling power in copper electroplating of wafers', Semiconductor Fabtech, 11th edn, 267; 2000, London, Semiconductor Media Ltd.

3. Through-Hole Filling by Copper Electroplating

4. Roles of Chloride Ion in Microvia Filling by Copper Electrodeposition

5. Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

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