Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/1362171810Y.0000000013
Reference26 articles.
1. Davis J R(ed.): ‘Aluminum and aluminum alloys’, 1st edn, 345–346; 1994, Materials Park, OH, ASM International.
2. Use of sputter coatings to control parent metal dissolution during transient liquid phase bonding
3. Transient liquid phase bonding
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