Interaction mechanism between void and interface grain boundary in diffusion bonding
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/1362171814Y.0000000242
Reference31 articles.
1. Interface evolution and bond strength when diffusion bonding materials with stable oxide films
2. Joining stainless steel metal foams
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5. Applications of superplastic forming and diffusion bonding to hollow engine blades
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