Transient liquid phase (TLP) brazing of Mg–AZ31 and Ti–6Al–4V using Ni and Cu sandwich foils
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/1362171814Y.0000000196
Reference31 articles.
1. Transient liquid phase bonding
2. Transient liquid phase bonding of magnesium alloy (Mg – 3Al – 1Zn) using copper interlayer
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4. Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings
5. Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections
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