Grain microstructure evolution and grain boundary junction engineering
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/174328405X63944
Reference15 articles.
1. J. von Neumann: in 'Metal interfaces', 108; 1952, Cleveland, American Society for Testing Materials.
2. Two‐Dimensional Motion of Idealized Grain Boundaries
3. Influence of triple junctions on grain boundary motion
4. Triple junction motion in aluminum tricrystals
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