Author:
Bendersky L.,Rosen A.,Mukherjee A. K.
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Engineering
Cited by
4 articles.
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1. EDITORIAL;International Materials Reviews;2010-01
2. Thermomechanical and Creep Behaviours of Au/Sn Solder Alloy;Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology;2006-01-01
3. Uniaxial and multiaxial creep behaviour of a tubular ferritic oxide-dispersion-strengthened alloy at 1100°C;Materials at High Temperatures;1997-01
4. Impression and diffusional creep of anisotropic media;Journal of Applied Physics;1995-01