Correlation between Special Grain Boundaries and Electromigration Behavior of Aluminum Thin Films
Author:
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering,Metals and Alloys
Link
http://www.tandfonline.com/doi/pdf/10.1179/cmq.1995.34.3.287
Reference20 articles.
1. Electromigration Damage in Aluminum Film Conductors
2. E. Nagasawa, H. Okabayashi, T. Nozaki and K. Nikawa. Proceedings of The 171h Reliability Physics Symposium, p. 64.IEEE. New York, 1979.
3. Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films
4. Influence of Preferred Orientation in Indium Tin Oxide.
5. Electromigration in Al/SiO2films prepared by a partially ionized beam deposition technique
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