1. Shen YZ and Ren ZC (eds.): ‘Principles and applications of semiconductor switching elements’; 1996, Beijing, Electronic Industry Press.
2. Advances in composite materials for thermal management in electronic packaging
3. Zhu DZ, Wu GH, Chen GQ and Zhang Q: ‘Fabrication and properties of SiC/Cu composites for electronic packaging’, Proc. 6th Int. Conf. on ‘Electronic packaging technology’, Shenzhen, China, September 2005, CIE-CEPS, Paper 191–194.
4. Metal-matrix composites for electronic packaging