Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/136217104225021869
Reference10 articles.
1. Observations on welding of2+O+&bgr;titanium aluminide
2. Temperature gradient transient liquid phase diffusion bonding: a new method for joining advanced materials
3. Transient liquid phase diffusion bonding and associated recrystallization phenomenon when joining ODS ferritic superalloys
4. Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints
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3. Study of TLP bonding of Ti-6Al-4V alloy produced by vacuum plasma spray forming and forging;Materials & Design;2017-05
4. Effects of temperature and strain rate on microstructure and mechanical properties of high chromium cast iron/low carbon steel bimetal prepared by hot diffusion-compression bonding;Materials & Design;2014-11
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