Numerical simulation of shear stress distribution in as soldered Al-Al2O3assembly
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/136217103225010862
Reference8 articles.
1. BONDING OF CERAMICS TO METALS WITH ACTIVATED COATING LAYERS MADE BY PLASMA SPRAYING
2. Elastoplastic deformation of multilayered materials during thermal cycling
3. An experimental investigation of failure initiation in bonded joints
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2. Viscoplastic Parameter Identification for Lead-Free Solder Alloy by Micro-Indentation, FE Simulation and Optimization;MATERIALS TRANSACTIONS;2008
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