Impression creep behaviour of tin based lead free solders
Author:
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1179/026708304225017283
Reference15 articles.
1. Metallurgy of low temperature Pb-free solders for electronic assembly
2. Low Temperature Soldering
3. Impression creep of LiF single crystals
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3. Evaluation of Bulk Mechanical Properties of Selected Lead-Free Solders in Tension and in Shear;Journal of Materials Engineering and Performance;2013-03-09
4. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys;Materials Science and Engineering: A;2013-01
5. Compression creep of 63Sn37Pb solder balls;Acta Materialia;2011-05
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