Characterization Of Epoxy Curing Using High Heating Rate DSC-Reference-Cited by-同舟云学术

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Characterization Of Epoxy Curing Using High Heating Rate DSC

Published:2006-03 Issue:1 Volume:10 Page:119-128
ISSN:1432-8917
Container-title:Materials Research Innovations
language:en
Short-container-title:Materials Research Innovations

Author:

Bilyeu Bryan,Brostow Witold,Menard Kevin P.

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1179/mri.2006.10.1.119

Reference24 articles.

1. Dorman EN (1969) Handbook of Fiberglass and Advanced Plastics Composites, Lubin G (ed) Van Nostrand Reinhold, New York p46

2. Jaffe M, Menczel JD, Bessey WE (1997) Thermal Characterization of Polymeric Materials, Turi E (ed) Academic Press, San Diego p1767

3. Intramolecular Reaction

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Debonding of bonded composite joints with TEP modified epoxy adhesives;The Journal of Adhesion;2022-12-11

2. Bond strength of polymer lightweight aggregate concrete;Polymer Composites;2013-08-10

3. Photo differential scanning calorimetry, UV thermal mechanical analysis and UV dynamic mechanical analysis of light cured acrylics;Materials Research Innovations;2013-06

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