Conductivity considerations for tin stannate electrodeposition solutions-Reference-Cited by-同舟云学术

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Conductivity considerations for tin stannate electrodeposition solutions

Published:2012-03 Issue:2 Volume:90 Page:64-69
ISSN:0020-2967
Container-title:Transactions of the IMF
language:en
Short-container-title:Transactions of the IMF

Author:

Gabe D R,Meng K

Publisher

Informa UK Limited

Subject

Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1179/0020296712Z.00000000013.A

Reference9 articles.

1. Price JW: ‘Tin and tin alloy plating’; 1983, Ayr, Electrochemical Publications.

2. Jordan M: ‘The electrodeposition of tin and its alloys’; 1995, Saulgau, Eugen G. Leuze.

3. Electrodeposition of tin from a sulphamate solution

4. Optimisation of nickel electrodeposition solutions for power usage

5. Gabe DR, Chen L, Li M, Ding Z: Proc. Nicholas Spyrellis Mem. Symp., Athens, Greece, June 2009, Technical University of Athens.

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