A new method of current density control during the pulse plating process
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/002029605X48914
Reference22 articles.
1. A Tertiary Current Distribution Model for the Pulse Plating of Copper into High Aspect Ratio Sub-0.25 μm Trenches
2. Mass Transfer Models for the Electrodeposition of Copper with a Buffering Agent
3. Methods for electrodepositing composition-modulated alloys
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1. Pulsed electrodeposition of compact, corrosion resistant, and bioactive HAp coatings by application of optimized magnetic field;Materials Chemistry and Physics;2020-11
2. Recent advances in pulsed current electrodeposition: a brief review;Transactions of the IMF;2010-09
3. Pulse plating in third millennium;Transactions of the IMF;2008-03
4. Pulse electrodeposited nickel molybdenum;Transactions of the IMF;2007-01
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