Electrodeposition of Cu onto Pt in presence of egg ovalbumin
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/174591907X192276
Reference48 articles.
1. Electrodeposition of Cu from Cyanoalkaline Solutions in the Presence of CPC and PEG
2. Anin situRaman Investigation of Organic Species Incorporated in Cu Layers Electrodeposited from PEG-containing Acidic Sulphate and Cyanoalkaline Electrolytes
3. Study on levellers for Cu electrodeposition from acidic sulphate solution: anin situspectroelectrochemical approach
4. Electrodeposition of Cu from Acidic Sulfate Solutions in the Presence of Bis-(3-sulfopropyl)-disulfide (SPS) and Chloride Ions
5. Electrodeposition of Cu from Acidic Sulphate Solutions in the Presence of PEG: An Electrochemical and Spectroelectrochemical Investigation – Part I
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