A Novel Substrate Integrated Waveguide (SIW) Based Highly Selective Filtering Power Divider

Author:

Mahant Keyur1,Mewada Hiren1

Affiliation:

1. Department of Electronics and Communication, Charotar University of Science and Technology, Changa, India

Abstract

Aims: In this paper, a novel Substrate Integrated Waveguide (SIW) based filtering power divider is presented. Objective: In the proposed power divider, filtering response is achieved by interleaving inductive posts in the SIW structure. The proposed structure reduces the size and the cost of the system, as the structure performs the function of the power divider as well as the function of a filter. Methods: Simulation of the proposed structure was carried out using commercial software Ansoft High Frequency Structure Simulator (HFSS), which is a three-dimensional full-wave solver utilizing the Finite Element Method (FEM). The proposed power divider structure was also fabricated and tested. Results: The measured return loss was found to be -21.78 dB with 3 dB Fractional Bandwidth (FBW) of 4.72% at the center frequency of 14.8 GHz. Moreover, the proposed structure showed an insertion loss of 0.96 dB, isolation of more than 18 dB; maximum amplitude and phase imbalance was observed to be 0.18 dB and 1.24° respectively within the operating frequency band. Conclusion: Good agreements are observed between the experimental results and the simulations.

Publisher

Bentham Science Publishers Ltd.

Subject

Electrical and Electronic Engineering,Control and Optimization,Computer Networks and Communications,Computer Science Applications

Reference18 articles.

1. Pozar D.M.; Microwave Engineering 2005

2. Matthaei G.L.; Microwave Filters, Impedance Matching and Coupling Structures 1980

3. Marcuvitz N.; Waveguide Handbook 1985

4. Gruenberg H.; Symmetrical placed inductive posts in rectangular wave-guide radio and electrical engineering division 1951

5. Xu F.; Wu K.; Guided-wave and leakage characteristics of substrate integrated waveguide. IEEE Trans Microw Theory Tech 2005,53(1),66-73

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