1. Wang H, Hao JJ, An CQ, Lin X. Planting and Finishing, 2013, 47: 39–44 (in Chinese) [王昊, 郝建军, 安成强, 林雪. 电镀与精饰, 2013, 35: 39–44].
2. Xu SL. Applications of IC, 2008, 177: 47–48 (in Chinese) [徐森林. 集成电路应用, 2008, 177: 47–48].
3. Wang ZJ, Yang L, Liu HF. Materials Protection, 2003, 05: 63–64 (in Chinese) [王志军, 杨磊, 刘海风.材料保护, 2003, 05: 63–64].
4. Liu ZR. Planting and Finishing, 2008, 184: 35–38 (in Chinese) [刘仁志.电镀与精饰, 2008, 184: 35–38].
5. Zhang ZH. Silicon Valle, 2011, 94: 6–55 (in Chinese) [张振华. 硅谷, 2011, 94: 6–55].